Main components of epoxy encapsulant 1. Epoxy resin Epoxy resin is an epoxy oligomer, which is an important component of epoxy potting compound. It reacts with a curing agent to form a thermosetting composite material with a three-dimensional network. In most cases, epoxy resins are used in liquid state and can be applied after curing at room temperature or heating. Liquid epoxy resin has a small shrinkage during the curing reaction, and has excellent characteristics such as heat resistance and adhesion after curing. It is a thermosetting resin variety with a large amount of application. Second, the curing agent Curing agent is an important component of epoxy resin potting compound. Different curing agents can obtain epoxy potting compounds with different properties. In the epoxy potting compound formulation system, two types of curing agents are most commonly used: anhydrides and amines. Anhydride curing agent is the most important curing agent for two-component heating curing epoxy potting compound. Commonly used varieties are liquid methylhexahydrophthalic anhydride, liquid methyltetrahydrophthalic anhydride, etc., such curing The viscosity of the agent is small and the dosage is large. It plays the role of curing and diluting in the potting compound formulation system. During the curing process, the heat release is gentle, and the comprehensive performance of the product after curing is excellent. Amine curing agent, used in room temperature curing potting adhesive, can be used to cure epoxy resin at room temperature. However, it has a strong irritating odor, combined with small addition, short pot life, intense heat release and other factors, so it is now Rarely used. 3. Thermally conductive filler Most of the thermally conductive fillers in potting compounds are inorganic powder materials. The addition of fillers can greatly improve the thermal conductivity of potting compounds. Compared with epoxy resin matrix, the filler has higher thermal conductivity and insulation, lower water absorption and linear expansion coefficient. Therefore, a sufficient amount of filler can significantly improve the process performance of the potting compound and the overall performance of the cured product To put it simply, the performance of the thermally conductive filler is the most critical factor that can satisfy the potting process and product requirements. 4. Other components To meet the specific performance requirements of the product, other components can be added to the formulation. Adding thinner can effectively reduce the viscosity of the potting system; adding antifoaming agent and anti-settling agent can improve the process performance of the material; adding flame retardant can improve the safety and reliability of the material; adding a coupling agent to improve the material The adhesion performance; adding colorant to meet the appearance requirements of the product, etc. Pull-Out Faucet,Pull Out Kitchen Taps,Pull Out Kitchen Faucet,Stainless Steel Kitchen Faucet AIHUI Sanitary Ware , https://www.fsaihuisanitary.com